170814-2009

Molex
538-170814-2009
170814-2009

Fabricante:

Descripción:
Conectores placa a placa y Mezzanine NeoScale Recpt 2.8mm 6x20 Gld 8mm Hght

Hoja de datos:
Modelo ECAD:
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Disponibilidad

Existencias:
No en existencias
Plazo de entrega de fábrica:
Mínimo: 240   Múltiples: 80
Precio unitario:
₡-
Precio ext.:
₡-
Est. Tarifa:

Precio (CRC)

Cantidad Precio unitario
Precio ext.
₡76 270 ₡18 304 800
320 Presupuesto

Atributo del producto Valor de atributo Seleccionar atributo
Molex
Categoría de producto: Conectores placa a placa y Mezzanine
RoHS:  
Connectors
360 Position
2.8 mm (0.11 in)
6 Row
Vertical
1 A
30 VAC
- 55 C
+ 85 C
Gold
Copper Alloy
Liquid Crystal Polymer (LCP)
170814
Tray
Marca: Molex
Régimen de inflamabilidad: UL 94 V-0
Estilo de montaje: Cable
Tipo de producto: Board to Board & Mezzanine Connectors
Cantidad de empaque de fábrica: 16
Subcategoría: Board to Board & Mezzanine Connectors
Nombre comercial: NeoScale
Alias de las piezas n.º: 1708142009 01708142009
Peso de la unidad: 16,426 g
Productos encontrados:
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Atributos seleccionados: 0

Hoja de datos

Models

Specification Sheets

CNHTS:
8536690000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

Board-to-Board Connectors

Molex Board-to-Board Connectors are available in a variety of configurations, offering an expansive array of pitches and stacking heights. The printed circuit board (PCB) is a foundational staple in the electronics industry, and with continuing trends toward miniaturization, designers need a more diverse range of solutions for creating dependable PCB connections. To fit a range of applications, Molex Board-to-Board Connectors include mezzanine, backplane, coplanar, and more. These connectors are ideal for microminiature and high-power applications.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.

NeoScale High-Speed Mezzanine System

Molex NeoScale High-Speed Mezzanine System delivers clean signal integrity at 56Gbps. This system features a high-speed triad wafer design with patented Solder-Charge Technology for customized PCB routing in high-density system applications. Ideal for small footprint designs with limited PCB real estate, the modular NeoScale mezzanine system offers a durable and easily customizable design tool for high-density system applications. Each Molex NeoScale triad wafer is an independent element in the housing and can be customized to a design layout. With four triad wafer configurations, users can mix and match components to build a mezzanine solution to meet application requirements for signals supporting high-speed differential pairs (85Ω and 100Ω), high-speed single-ended transmissions, low-speed single-ended signals, and power contacts.

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