1714505114

Molex
538-1714505114
1714505114

Fabricante:

Descripción:
Conectores placa a placa y Mezzanine SpeedStack Vertical Receptacle, 0.80mm Pitch, 4.10mm Height, 82 Circuits, UL94V-0, Black

Modelo ECAD:
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Disponibilidad

Existencias:
No en existencias
Plazo de entrega de fábrica:
Mínimo: 1800   Múltiples: 1800
Precio unitario:
₡-
Precio ext.:
₡-
Est. Tarifa:

Precio (CRC)

Cantidad Precio unitario
Precio ext.
₡6 699 ₡12 058 200

Atributo del producto Valor de atributo Seleccionar atributo
Molex
Categoría de producto: Conectores placa a placa y Mezzanine
171450
Marca: Molex
Tipo de producto: Board to Board & Mezzanine Connectors
Cantidad de empaque de fábrica: 1800
Subcategoría: Board to Board & Mezzanine Connectors
Nombre comercial: SpeedStack
Alias de las piezas n.º: 171450-5114 01714505114
Productos encontrados:
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Atributos seleccionados: 0

CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
BRHTS:
85366990
ECCN:
EAR99

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.

SpeedStack Mezzanine Connector System

Molex SpeedStack Mezzanine Connector System offers a high-density, low-profile solution that delivers data rates up to 40Gbps per differential pair. With mated stack heights of 4mm to 10mm with a 0.80mm pitch, these connectors provide design flexibility for PCB space-constrained applications. The narrow housing design minimizes airflow obstructions and promotes system cooling. Molex SpeedStack Mezzanine Connector System utilizes a split-pad PCB design that allows for electrical tuning performance and provides edge card compatibility. The robust insert-molded wafer design with protected shrouded housing supports the terminal location to improve electrical balance within the signals for low-profile, high-density systems. In addition, a common grounding pin improves electrical performance and minimizes crosstalk. 

SpeedMezz Connector Family

Molex SpeedMezz Connector Family offers high densities, low profiles, data rates up to 56Gbps per differential pair. These products provide easy upgrading with common receptacle footprints. Molex SpeedMezz Connector Family delivers versatile solutions for high-speed mezzanine, rugged edge card, and lower speed applications.