(Source: kwarkot / stock.adobe.com)
Artificial intelligence (AI) has garnered so much attention over the last few years that very few areas of modern life do not benefit from AI or machine learning (ML) in some way. This growth has generated enormous demands on data centers. Their architecture has changed to cope with the ever-increasing volume of data, and the infrastructure that supports it has evolved in parallel to provide reliable communication in the data center environment.
As a result, data centers must adopt high-speed, low-latency connectivity solutions to keep pace with evolving workloads. A new trend called disaggregation has made this need even more critical.
Typical architectures provide each processor with its own memory. This keeps latency low but results in inefficient use of memory resources. As requirements vary over time, a processor may experience a period of low activity while another is overloaded. The result is a situation in which the overloaded module has insufficient memory capacity while an adjacent module has memory to spare.
Disaggregation removes the memory from each processor and pools it to create a single resource that can be used more effectively. However, this physical separation of memory and processor emphasizes the need for high-performance connectivity.
When selecting connectivity for the latest data center architectures, engineers must choose components that can support the current and future needs of the AI revolution. However, this is not the only consideration that affects connector selection. Engineers must ensure that their connectors can handle the required data throughput, are durable for long-term use, and are compatible with existing systems for simple upgrades. The Peripheral Component Interconnect Express (PCIe®) is a key interconnect for high-speed internal data transfers in data centers that power the latest AI applications.
Another critical concern for operators is heat management. As computing power demand increases, some racks are drawing as much as 100kW. This power increase creates a similar rise in the heat generated by the equipment. The effort required to cool a data center can represent up to 40 percent of its total operating costs.[1] According to American Society of Heating, Refrigerating and Air-Conditioning Engineers (ASHRAE) guidelines, recommended ambient temperatures for data centers range from 64.4°F to 80.6°F (18°C to 27°C).[2] As energy costs rise, many operators are now operating at the higher end of that range.
Connectors play a big role in thermal management. As some of the largest components on modern printed circuit boards (PCBs), their size and placement can affect airflow and directly impact how effectively the system stays cool.
It is also important to understand the effect of temperature on the connector's performance. A high density of active components or uneven cooling can create hotspots. Connectors must be unaffected by higher temperatures, not simply for safety but to maintain the efficiency of the connector itself. At high temperatures, it is necessary to reduce the electrical current passing through a connector to prevent further heat from being created.
This means designers need to balance compatibility with existing infrastructure, maximizing the capability of the systems and the need to cool the system in use. Connectors are vital to these considerations.
To help the modern engineer, Amphenol FCI has released the PCI Express Gen 5 Flip CEM card edge connector. It employs the standard PCIe interface, ensuring compatibility with the array of equipment from previous generations already in service (Figure 1).[3] However, the design features of the Gen 5 connector deliver key advantages for the latest data center applications.
Figure 1: Amphenol FCI PCI Express Gen 5 Flip CEM card edge connectors are compatible with existing equipment and save up to 19.5 percent space in PCB keep-out areas. (Source: Mouser Electronics)
Traditional PCIe connectors feature two rows of contacts, each arranged at 180° orientation to each other, creating a PCB footprint larger than the connector body. In contrast, the Amphenol Flip CEM design aligns both rows of contacts in the same direction, reducing the PCB footprint by up to 19.5 percent. The result is a connector ideal for applications that must be placed close to the edge of the PCB.
The Amphenol Gen 5 PCIe connector is compatible with existing equipment and offers full Gen 5 capabilities up to 32GT/s. Its robust design supports current data center needs and offers a clear upgrade path as technology continues to evolve.
The AI revolution is driving the appetite for more data. Data center architectures are evolving to ensure that they not only meet today's requirements but are also robust and flexible enough to accommodate future demands.
Amphenol has years of expertise refining the PCIe interface and developed the Gen 5 Flip connector to support evolving data center needs while maintaining compatibility with existing equipment.
David Pike is well known across the interconnect industry for his passion and general geekiness. His online name is Connector Geek.
Sources
[1] https://restservice.epri.com/publicdownload/000000003002028905/0/Product [2] https://www.ashrae.org//File%20Library/Technical%20Resources/Bookstore/ASHRAE_TC0909_Power_White_Paper_22_June_2016_REVISED.pdf [3] https://www.mouser.com/new/amphenol/amphenol-pcie-cem-card-edge-connectors/
Amphenol Corporation is a designer, manufacturer, and marketer of electrical, electronic and fiber optic connectors, interconnect systems, and coaxial and flat-ribbon cable. Amphenol Corporation has developed a range of connector and interconnect products for the information technology and communications equipment applications, including the converging voice, video, and data communications markets. The primary end markets for the Company's products are communications and information processing markets, cellular telephone and data communication, information processing systems, commercial aviation, aerospace and military electronics, as well as automotive, rail and other transportation and industrial applications.