FS01M3R08A8MA2CHPSA1

Infineon Technologies
726-FS01M3R08A8MA2CH
FS01M3R08A8MA2CHPSA1

Mfr.:

Description:
Discrete Semiconductor Modules HybridPACK Drive G2 module with SiC MOSFET

Lifecycle:
New Product:
New from this manufacturer.
Datasheet:
ECAD Model:
Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.
More Information
Learn more about Infineon Technologies FS01M3R08A8MA2CHPSA1

Product Attribute Attribute Value Select Attribute
Infineon
Product Category: Discrete Semiconductor Modules
Module
SiC
4.56 V
- 5 V, + 19 V
Press Fit
HybridPACK
- 40 C
+ 175 C
Tray
Brand: Infineon Technologies
Fall Time: 58 ns
Id - Continuous Drain Current: 530 A
Product Type: Discrete Semiconductor Modules
Rds On - Drain-Source Resistance: 2 mOhms
Rise Time: 96 ns
Factory Pack Quantity: 6
Subcategory: Discrete and Power Modules
Tradename: HybridPACK
Typical Turn-Off Delay Time: 338 ns
Typical Turn-On Delay Time: 114 ns
Vds - Drain-Source Breakdown Voltage: 750 V
Vgs th - Gate-Source Threshold Voltage: 4.55 V
Part # Aliases: FS01M3R08A8MA2C SP006157554
Products found:
To show similar products, select at least one checkbox
Select at least one checkbox above to show similar products in this category.
Attributes selected: 0

Datasheet

Compliance Codes
ECCN:
EAR99
Origin Classifications
Country of Origin:
Germany
Assembly Country of Origin:
Germany
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

HybridPACK™ Drive G2 Modules

Infineon Technologies HybridPACK™ Drive G2 Modules are compact power modules designed for hybrid and electric vehicle traction. The Infineon Technologies G2 modules offer scalable performance levels using Si or SiC technologies and different chipsets, maintaining the same module size. Introduced in 2017 with silicon EDT2 technology, it was optimized for efficiency in real-world driving. In 2021, a CoolSiC™ version was introduced, offering higher cell density and better performance. In 2023, the second generation, HybridPACK Drive G2, was launched with EDT3 (Si IGBT) and CoolSiC™ G2 MOSFET technologies, providing ease of use and integration options for sensors, enabling up to 300kW performance within 750V and 1200V classes.

In Stock: 3

Stock:
3 Can Ship Immediately
Factory Lead-Time:
52 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
₡-,--
Ext. Price:
₡-,--
Est. Tariff:

Pricing (CRC)

Qty. Unit Price
Ext. Price
₡357 216,22 ₡357 216,22

An unexpected error has occurred.


Have a question? Please visit the Help Center.
For questions about a specific order, please log in to your account.

If you encounter further problems, please contact us on 800-346-6873 or email help@mouser.com.