Terminales IDC multipunto

TE Connectivity's (TE) / ERNI Multi-Point Insulation Displacement Contact (IDC) Terminals provide reliable wire-to-board connections while facilitating fully automated board assembly in miniaturized applications. These surface-mount (SMT) terminals feature IDC contacts that significantly reduce wire preparation (stripping) before termination. The IDC design allows the discrete wires to be processed reliably and reproducibly, eliminating costly and unreliable hand soldering. The IDC terminals also help enable multi-point connection via a one-time press. The series is available for stranded wires with 26AWG or 24AWG outer diameters and supports a maximum current carrying capacity of up to 8A at +20°C. TE / ERNI Multi-Point IDC Terminals include 2P, 4P, and 5P options, making them suitable for applications such as sensor and amplifier units, mobile devices, retrofit LED lamps, smart metering equipment, and medical equipment.