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ADM6-20-01.5-L-4-0-FR

Name: Samtec ADM6-20-01.5-L-4-0-FR
Brand: Samtec
SKU: 200-ADM620015L40FR
Price: 4746.64 CRC
Availability: OutOfStock

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Mouser #:

200-ADM620015L40FR

Mfr. #:

ADM6-20-01.5-L-4-0-FR

Mfr.:

Samtec

Description:

Board to Board & Mezzanine Connectors 0.635 mm AcceleRate HD High-Density 4-Row Terminal

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

ADM6-20-01.5-L-4-0-FR Datasheet (PDF)

ECAD Model:

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Learn more about Samtec ADM6-20-01.5-L-4-0-FR

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Samtec
Product Category:	Board to Board & Mezzanine Connectors
Product:	Plugs
Number of Positions:	80 Position
Pitch:	0.635 mm (0.025 in)
Number of Rows:	4 Row
Termination Style:	Solder Balls
Mounting Angle:	Straight
Stack Height:	2.9 mm
Current Rating:	1.34 A
Voltage Rating:	155 VAC, 219 VDC
Maximum Data Rate:	64 Gbps
Minimum Operating Temperature:	- 55 C
Maximum Operating Temperature:	+ 125 C
Contact Plating:	Gold
Contact Material:	Copper Alloy
Housing Material:	Liquid Crystal Polymer (LCP)
Series:	ADM6
Packaging:	Reel
Brand:	Samtec
Data Rate:	64 Gbps
Mounting Style:	PCB Mount
Product Type:	Board to Board & Mezzanine Connectors
Factory Pack Quantity:	875
Subcategory:	Board to Board & Mezzanine Connectors
Tradename:	AcceleRate HD

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Datasheet

ADM6-20-01.5-L-4-0-FR Datasheet (PDF)

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Compliance Codes

CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
BRHTS:: 85366990
ECCN:: EAR99

Origin Classifications

Country of Origin:: Vietnam
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

High-Density Arrays

Samtec High-Density Arrays include board-to-board mezzanine connectors and rectangular cable assemblies. These components are offered in a range of mounting angles, including horizontal, right, straight, and vertical with a wide selection of termination styles. The number of positions ranges from 100 to 560 while the number of rows ranges from 4 to 14. Samtec High-Density Arrays are available in several pitches, including 0.635mm, 0.8mm, and 1.27mm.

Ultra Micro Interconnects

Samtec Ultra Micro Interconnects offer a stack height as low as 2.31mm and pitches of 0.4mm, 0.5mm, 0.635mm, and 0.8mm. One to four rows are available, and termination styles include solder, solder balls, and solder pin. Samtec Ultra Micro Interconnects are available in several mounting angles, including horizontal, right, straight, and vertical. The product lineup features connectors, headers, receptacles, sockets, and hermaphroditic connectors.

5G Solutions

Samtec 5G Solutions support the ultra-high frequencies and high data rates that emerging 5G technologies demand. As this 5G network quickly gains momentum, new systems, devices, and equipment are needed for technologies such as mmWave, Massive MIMO, beamforming, and full-duplex (FDX). Samtec 5G Solutions feature high-performance products for four applications: Test and Development Systems, Remote Radio and Active Antennas, Network Equipment, and Automotive and Transportation.

Flexible Stacking Connectors

Samtec Flex Stacking Board Connectors feature a large variety of board-to-board connectors with design flexibility. These Samtec board-to-board connector systems are available in a variety of pitches, densities, stack heights, orientations, and other standard or modified options, making it easy to find the right connector for any application. Flex-Stack options include one-piece, low profile pass-through, elevated, hermaphroditic, shrouded, coplanar, parallel, and perpendicular. Post heights are adjustable in increments of 0.005” (0.13mm).

AcceleRate® HD Ultra-Dense Mezzanine Strips

Samtec AcceleRate^® HD Ultra-Dense Mezzanine Strips feature a low-profile 5mm stack height, slim 5mm width, and a 0.635mm pitch. These micro interconnects are super dense with up to 400 total inputs/outputs (I/Os). The four-row design allows 10 to 100 positions per row. Samtec AcceleRate HD header and socket connectors are PCIe^® 6.0/CXL^® 3.2 capable, support 64Gbps PAM4 (32Gbps NRZ) applications, and feature an Edge Rate^® contact system that is optimized for signal integrity performance. The open-pin-field design offers grounding and routing flexibility.