UDx6 AcceleRate® mP 0.635mm Signal/Power Arrays

Samtec UDx6 AcceleRate® mP 0.635mm Signal/Power Arrays are 0.635mm pitch high-density, high-speed signal/power arrays that achieve 64Gbps PAM4 speeds. These Samtech signal/power arrays feature rotated power blades for improved performance and simplified breakout region (BOR). These UDx6 AcceleRate MP series features 5mm and 10mm stack heights and up to 10 power and 240 signal positions. The signal/power arrays offer an open-pin-field design for routing and grounding flexibility. The series includes optional alignment pins, standard weld tabs for a secure connection to the board, and polarized guide posts for blind mating.

Resultados: 40
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Descripción Hoja de datos Disponibilidad Precio: (CRC) Filtre los resultados en la tabla por precio unitario en función de su cantidad.
Cantidad RoHS Modelo ECAD Producto
Número de posiciones
Paso
Número de filas
Estilo de terminación
Ángulo de montaje
Régimen de corriente
Régimen de voltaje
Velocidad de transmisión de datos máxima
Temperatura de trabajo mínima
Temperatura de trabajo máxima
Revestimiento del contacto
Material del contacto
Material del alojamiento
Serie
Samtec Conectores placa a placa y Mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
Hoja de datos
25Se espera el 14/9/2026
Min.: 1
Mult.: 1

Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Conectores placa a placa y Mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
Hoja de datos
25Se espera el 12/10/2026
Min.: 1
Mult.: 1

Connectors 100 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Conectores placa a placa y Mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
Hoja de datos
25Se espera el 20/10/2026
Min.: 1
Mult.: 1

Connectors 60 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Conectores placa a placa y Mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
Hoja de datos
22Se espera el 9/11/2026
Min.: 1
Mult.: 1

Connectors 90 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Conectores placa a placa y Mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
Hoja de datos
25Se espera el 19/10/2026
Min.: 1
Mult.: 1

Connectors 120 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Conectores placa a placa y Mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
Hoja de datos
25Se espera el 20/10/2026
Min.: 1
Mult.: 1

Connectors 150 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Conectores placa a placa y Mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Hoja de datos
25Se espera el 21/9/2026
Min.: 1
Mult.: 1

Connectors 40 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Conectores placa a placa y Mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Hoja de datos
25Se espera el 20/10/2026
Min.: 1
Mult.: 1

Connectors 40 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Conectores placa a placa y Mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Hoja de datos
25Se espera el 19/10/2026
Min.: 1
Mult.: 1

Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Conectores placa a placa y Mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Hoja de datos
25Se espera el 19/10/2026
Min.: 1
Mult.: 1

Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Conectores placa a placa y Mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Hoja de datos
25Se espera el 19/10/2026
Min.: 1
Mult.: 1

Connectors 80 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Conectores placa a placa y Mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Hoja de datos
25Se espera el 20/10/2026
Min.: 1
Mult.: 1

Connectors 80 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Conectores placa a placa y Mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Hoja de datos
25Se espera el 7/10/2026
Min.: 1
Mult.: 1

Connectors 100 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Conectores placa a placa y Mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Hoja de datos
25Se espera el 20/10/2026
Min.: 1
Mult.: 1

Connectors 100 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Conectores placa a placa y Mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Hoja de datos
25Se espera el 19/10/2026
Min.: 1
Mult.: 1

Connectors 60 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Conectores placa a placa y Mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Hoja de datos
25Se espera el 19/10/2026
Min.: 1
Mult.: 1

Connectors 60 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Conectores placa a placa y Mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Hoja de datos
22Se espera el 19/10/2026
Min.: 1
Mult.: 1

Connectors 90 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Conectores placa a placa y Mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Hoja de datos
25Se espera el 20/10/2026
Min.: 1
Mult.: 1

Connectors 120 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Conectores placa a placa y Mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Hoja de datos
25Se espera el 20/10/2026
Min.: 1
Mult.: 1

Connectors 150 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Conectores placa a placa y Mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
Hoja de datos
25Se espera el 14/9/2026
Min.: 1
Mult.: 1

Connectors 40 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Conectores placa a placa y Mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
Hoja de datos
25Se espera el 14/9/2026
Min.: 1
Mult.: 1

Connectors 80 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Conectores placa a placa y Mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Hoja de datos
25Se espera el 19/10/2026
Min.: 1
Mult.: 1

Connectors 90 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Conectores placa a placa y Mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Hoja de datos
25Se espera el 20/10/2026
Min.: 1
Mult.: 1

Connectors 120 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Conectores placa a placa y Mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Hoja de datos
25Se espera el 20/10/2026
Min.: 1
Mult.: 1

Connectors 150 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Conectores placa a placa y Mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
Hoja de datos
Plazo de entrega no en existencias 10 Semanas
Min.: 350
Mult.: 1

Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6