Ultra Low Profile Spring-Loaded Headers

Mill-Max Ultra Low Profile Spring-Loaded Headers are only 0.100” in height. The trend toward miniaturization in electronic packaging demands smaller interconnects that deliver high-quality performance, the Ultra Low Profile Spring-Loaded Headers offer an above-board profile of 0.100”, mid-stroke travel of 0.012” (0.3mm), and full stroke of 0.024” (0.61mm.). They are offered in single 2 to 32 positions and the double row in 4 to 72 positions. The high-temperature plastic housing is suitable for all soldering processes, and the connectors are RoHS compliant.