Advanced Thermal Solutions Straight Fin Value-Line Heat Sinks
Advanced Thermal Solutions Straight Fin Value-Line Heat Sinks are high-performance heat sinks with high aspect ratios and are ideal for compact PCB environments. These heat sinks are available for component sizes 10mm x 10mm to 60mm x 60mm with height ranges from 2mm to 25mm with 1mm increments. The straight fin value-line heat sinks can be attached to the devices with double-sided thermal adhesives, Z-clip, or maxiGRIP™ technologies. The higher performance helps ensure reliable product life at a lower cost than other extruded heat sinks. The straight fin design offers an excellent cooling solution for spatially constrained PCB layouts. These straight-fin heat sinks can be applied to various components, including Altera®, AMD, Freescale, Intel®, TI, and Xilinx.
Features
- High aspect ratio, straight fin heat sinks are ideal for compact PCB environments
- Higher performance helps ensure reliable product life at a lower cost than other extruded heat sinks
- Available for component sizes 10mm x 10mm to 60mm x 60mm with height ranges from 2mm to 25mm with 1mm increments
- Can be attached to the device with double-sided thermal adhesives, Z-clip, or maxiGRIP™ technologies
- Extruded aluminum minimizes thermal resistance, reduces weight, and keeps costs low
- Comes standard without interface material or with most common pressure-sensitive thermal tapes as a custom option
Applications
- Can be applied to a wide variety of components, including:
- Altera®
- AMD
- Freescale
- Intel®
- TI
- Xilinx
Dimensions
Associated Heat Sinks
Advanced Thermal Solutions BGA - High Aspect Ratio Value-Line Heat Sinks
High-performance heat sinks are offered in pin fin, straight fin, and slant fin profiles.
Publicado: 2023-07-25
| Actualizado: 2023-08-08