Boréas Technologies Micropump Liquid Cooling

Distinguished from conventional cooling approaches, the Boréas' platform achieves exceptional thermal efficiency while preserving sleek product aesthetics. The CapDrive™ framework guarantees minimal energy usage alongside accurate regulation for optimal fluid circulation. This advancement supports enhanced processor capabilities and consistent performance within miniaturized devices, ensuring comfortable user interaction temperatures.

Through Boréas' micropump liquid cooling implementation, device creators can expand system potential, supported by advanced thermal engineering solutions that redefine what's possible in compact form factors.

Temperature Control Obstacles in AI and Flexible Device Technologies

Heat regulation has become the primary performance limitation for modern electronics, especially within miniaturized, portable systems where dimensional restrictions constrain thermal solutions. This obstacle intensifies significantly within bendable smartphone segments, where the available heat dissipation surface is reduced by half, while conventional passive cooling methods cannot accommodate flexing components. As the sector transitions toward integrated AI processing, neural processing unit (NPU) incorporation into system-on-chip architectures will produce extraordinary thermal loads.

NPU introduction in mobile platforms represents a transformative phase in handheld device development, offering advanced AI functionality while requiring revolutionary temperature management approaches. This evolution demands complete heat control strategy reconceptualization, compelling manufacturers to create sophisticated cooling innovations that sustain peak performance while maintaining streamlined product profiles.

As the mobile industry accelerates toward embedded AI implementation, superior thermal management will inevitably distinguish leading next-generation smartphone technologies from competitors.

The thermal management platform employs PET membrane technology, demonstrating superior adaptability, sustaining over 200,000 flex cycles while maintaining operational integrity. This extraordinary durability enables seamless incorporation into advanced bendable electronics, including mobile devices and portable computers.

The PET membrane integrated within the thermal system achieves remarkably minimal thickness specifications, reaching as low as 0.3mm. This ultra-compact design facilitates effortless embedding within space-constrained electronic products while preserving streamlined aesthetic appeal.

This implementation becomes viable exclusively through CapDrive innovation (delivering 10x energy efficiency improvements). Alternative piezo actuators produce excessive thermal output beyond what the cooling system can effectively manage.

View the BOS1921 Starter Development Kit