IEI Technology TANK-XM813 Fanless Embedded Computer
IEI Technology TANK-XM813 Fanless Embedded Computer is a rugged, high-performance system designed for industrial and edge AI applications. Powered by Intel® 12th Gen Core™ processors with hybrid architecture, the PC delivers exceptional computing power and energy efficiency for demanding workloads. The fanless design and wide operating temperature range ensure reliable performance in harsh environments, while the modular architecture supports PCIe Gen4 expansion for GPUs, frame grabbers, and AI accelerators.
The IEI TANK-XM813 features dual 2.5GbE LAN ports, optional PoE+ capability, and a rich set of I/O interfaces, including USB 3.2, COM ports, and digital I/O, making the computer highly adaptable for industrial integration. With AI-ready architecture supporting Intel AI Boost and NVIDIA GPUs, this system is ideal for applications such as machine vision, factory automation, Industrial Internet of Things (IIoT), smart surveillance, and transportation systems. The compact, rugged chassis provides durability and scalability, making the device a reliable solution for edge computing and intelligent infrastructure.
Features
- High-performance Intel Core Ultra Processors (Series 2)
- Supported CPUs
- Intel Core Ultra 9 285T 1.4GHz (up to 5.4GHz, 24-core, 35W TDP)
- Intel Core Ultra 9 285 2.5GHz (up to 5.6GHz, 24-core, 65W TDP)
- Intel Core Ultra 7 265T 1.5GHz (up to 5.3GHz, 20-core, 35W TDP)
- Intel Core Ultra 7 265 2.4GHz (up to 5.3GHz, 20-core, 65W TDP)
- Intel Core Ultra 5 225T 2.5GHz (up to 4.9GHz, 10-core, 35W TDP)
- Intel Core Ultra 5 225 3.3GHz (up to 4.9GHz, 10-core, 65W TDP)
- Integrated Intel Arc Graphics from the Core Ultra processor that delivers vivid 4K visuals and smooth playback
- Intel Platform Trust Technology (Intel PTT) to enable password protection, device authentication, and future-ready cybersecurity
- Dual-power architecture
- Built-in NPU for AI acceleration
- Supports full-length 3-slot GPU cards
- 2x 2.5G Ethernet ports
- Multiple USB ports and serial ports
- Multiple internal expansion boards for flexible selection
- Various optional backplanes and chassis
- Enhanced wireless connectivity
- Scalable modular design
- Industrial-grade hardened hardware design with 12VDC to 28VDC wide-range power input
- Fanless cooling eliminates failure points
- High-efficiency
- Wide -20°C to +60°C operating temperature
- 50G shock and 3GRMS vibration
- CE/FCC compliant
Applications
- Edge AI and intelligent inference
- Object detection
- Defect detection
- Pattern recognition
- Machine vision
- Automated inspection
- Assembly line quality control
- Vision-guided robotics
- Factory automation and industrial IoT
- Controlling equipment
- Real-time data logging
- Distributed process control
- Transportation and smart infrastructures
- Transit systems
- Traffic monitoring
- Intelligent transport applications
- Medical imaging
- Imaging devices
- Embedded diagnostic systems
- Smart surveillance and security
- Advanced/smart manufacturing
- Predictive maintenance
- Robotics control
- Edge analytics
Specifications
- Chassis
- Black C color
- 230.6mm x 255mm x 68.7mm (WxDxH) dimensions
- Fanless system
- Extruded aluminum alloy construction
- Motherboard
- 6x Intel Core Ultra options
- W880 chipset
- 2x SO-DIMM DDR5 5600 memory (16GB pre-installed) (up to 96GB)
- I/O interfaces
- Ethernet
- 1x 2.5 GbE by Intel I226LM controller
- 1x 2.5 GbE by Intel I226-V controller
- 7x USB 3.2 Gen 2 (10Gb/s)
- 2x RS-232/422/485 and 4x RS-232 COM
- 12-bit (6-in/6-out) DB15 digital I/O
- 1x DP++, 1x HDMI, and 1x USB4 (Display+USB 3.2 Gen 2x2) display interfaces
- 1x Mic and 1x Line out for audio
- TPM
- 1x Intel TPM
- 1x 20-pin TPM connector (optional TPM-IN03 module)
- 1x Power button
- 1x 2-pin terminal block for Remote Power Button
- 1x Reset button
- 1x AT/ATX switch
- 1x Power LED (red)
- 1x HDD LED (green)
- 1x 4-pin external system fan connector
- Ethernet
- 2x 2.5” SATA 6Gb/s HDD/SSD bay storage (RAID 0/1 supported)
- Internal expansions
- M.2
- 1x 2280 M-key (PCIe Gen4 x4)
- 1x 2230 A-key (USB+PCIe Gen3 x1, supports vPRO)
- Optional expansion backplane
- M.2
- Power
- 12VDC to 28VDC power input range
- 12V power consumption at 8.8A (Intel Core Ultra 9 285 with 16GB memory)
- Reliability
- Wall mount
- Operating temperature ranges
- -20°C to +60°C (CPU TDP35W &SSD)
- -20°C to +50°C (CPU TDP65W &SSD), 10% to 95% non-condensing
- -40°C to +85°C storage temperature range, 10% to 95%, non-condensing
- Operating shock - IEC68-2-27 half-sine, 5G, 11ms, 100 shocks with SSD
- Operating vibration - MIL-STD-810H 514.8C-I with SSD
- 3.24kg/3.6kg weight (net/gross)
- Programmable watchdog timer, 1sec/min to 255sec/min
- Supported OS - Windows® 10/11 IoT Enterprise/Linux
Accessories
- Modules
- TPM-IN03 SPI TPM 2.0 module, software management tool
- EMB-WIFI-KIT02I3 M.2 A/E Key Wi-Fi 6E module kit
- Power adapter/cord - 63040-010180-200-RS 180W AC/DC power adapter
- Expansion backplane
- TXCBP-XM81-2A 2-slot backplane
- TXCBP-XM81-2B 2-slot backplane
- TXCBP-XM81-4A 4-slot backplane
- TXCBP-XM81-4B 4-slot backplane
- TXCBP-XM81-G2-PW-R11 6-slot backplane
- IDD-X1228150 150W/380W power module
- Expansion chassis
- TXC-XM81-3S 3-slot expansion chassis
- TXC-XM81-4S 4-slot expansion chassis
- TXC-XM81-G1 4-slot expansion chassis
- TXC-XM81-G2 6-slot expansion chassis
- Internal expansion boards
- GPOE-XM81 expansion I/O board module, 8x2.5G LAN with POE
- TXIOB-XM81-A expansion I/O board module, 2xM.2 B Key, 1xM.2 A Key, 1xMiniPCIe
Integrated I/O
Dimensions (mm)
