Laird Technologies Tflex SF7 Thermal Gap Fillers
Laird Technologies Tflex SF7 Thermal Gap Fillers are innovative, high-performing thermal materials with silicone-free construction. The silicone-free design supplies products with excellent deflection properties, providing minimal pressure on components during deflection. A minimum amount of pressure is required to reach the lowest possible thermal resistance. These fillers offer a 0.5mm to 4mm thickness range, 7.8W/mK thermal conductivity, and 5 x 10^13 volume resistivity. Laird Technologies Tflex SF7 Thermal Gap Fillers are ideal for datacom systems, optical modules, cameras, and automotive electronics.
Features
- Silicone-free formulation
- Low peak and residual pressure
- Excellent surface wetting for low-contact resistance
- Exceptionally low thermal resistance
- UL V-0 flammability rating
Applications
- Datacom systems
- Automotive electronics
- Telecom systems
- Optical modules
- Cameras
Specifications
- Dark gray color
- 0.5mm to 4mm thickness range
- 7.8W/mk thermal conductivity
- -65°C to +150°C operating temperature range
- 3.4g/cc density
- 7.9kV/mm dielectric breakdown voltage
- 5 x 10^13 volume resistivity
- Shelf life
- 2 years from date of shipment
- No change for materials with DF, 1 year for all products with adhesive
Related Fillers
Laird Technologies Tflex SF4 Thermal Gap Fillers
Silicon-free and offers a 0.5mm to 4mm thickness range with 4.0W/mK thermal conductivity.
Publicado: 2024-09-05
| Actualizado: 2025-06-17